ByteCool – Direct to Chip Liquid Cooling

Cool Smarter, Scale Faster With Direct-to-Chip Liquid Technology

Purpose-built for high-density computing environments in Saudi Arabia, ByteCool Direct-to-Chip (D2C) cooling is tailored to meet the rising demands of AI, ML, energy storage, GPT applications, and more. 

ByteCool’s D2C system addresses the high thermal densities of modern CPUs and GPUs by delivering liquid coolant directly to the processor surface, efficiently removing heat at its source. With a thermal transfer capability thousands of times greater than air, the system significantly reduces reliance on high-speed fans and excessive airflow.

Once server power requirements exceed 400 W per unit, air cooling is no longer a viable option. ByteCool’s solution is engineered for such workloads, offering a fully integrated cooling architecture with four modular components: the coolant distribution unit (CDU), precision manifolds and connectors, a free cooling chiller, and a dry cooler.

Coolant Distribution Units (CDUs) (BT-050-CL, BT-350-CL, BT-010-CA, BT-060-CL)

  • 19-inch rack-compatible design for smooth integration into existing IT infrastructure
  • Smart control interface enables both local and remote system management
  • Plug and play installation with self-healing quick connectors
  • Cooling types: Liquid-to-liquid and liquid-to-air
  • Capacity range: 10.5 kW to 355.5 kW
  • Operating temperature: Supply at 45 °C
  • Coolants supported: Water, or water-glycol mixtures
  • Mounting: Rack, floor, or row-mounted, depending on model

Manifolds & Connectors

  • Built from stainless steel for strength and longevity
  • Plug-and-play design with dry-disconnect and quick-connect compatibility
  • Interfaces efficiently between server cold plates and the CDUs
  • Flexible routing options, supports vertical and horizontal loop configurations

ChillFlow Free Cooling Chiller (CF-50 & CF-350)

  • Cooling capacity in DX and FC mode: 50–350 kW / 52–390 kW
  • Optimized for natural cooling at lower ambient temperatures
  • Threaded internal piping ensures high-efficiency heat transfer
  • Operates reliably with water or water-ethylene glycol mixtures
  • Compatible with eco-friendly refrigerants such as R407C and R134A
  • Optional wet-film evaporative cooling to improve intake air efficiency and lower PUE
  • Built-in design verification through extensive testing

Dry Cooler (KSF50DC & KSF350DC)

  • Comprises a high-efficiency heat exchange system
  • Cooling capacity: 50 kW and 350 kW respectively
  • Works with water, glycol, or mixed coolant for various ambient conditions
  • VDC fan configuration
  • Operating temperature range: –35 °C to +35 °C
  • Optional wet-film element adds evaporative cooling to reduce intake air temperature
  • Corrosion-resistant construction supports long-term outdoor operation

Reviews

There are no reviews yet.

Be the first to review “ByteCool – Direct to Chip Liquid Cooling”

Your email address will not be published. Required fields are marked *